Structure-specific Binding of the Two Tandem HMG
Boxes of HMG1 to Four-way Junction DNA is Mediated by the A Domain
Michelle Webb and Jean O. Thomas*
J.Mol.Biol.
294, 373-387 (1999)
Abstract:
HMG-1 contain two homologous HMG-box
domains (A and B) of about 80 amino acid residues whose structures have
been determined. In this paper, they have used two approaches to investigate
the interaction of the AB didomain with the four-way junction. AB didomain
binding favors the open form of the junction, as shown by reaction with
potassium permanganate. Site-directed cleavage of the DNA by a 1,10-phenanthroline-copper
moiety attached to cysteine residues in the A or B domain shows that the
two linked HMG boxes are not functionally equivalent in four-way junction
binding. The A domain of the didomain binds to the central of the junction.
The B domain makes contacts along one of the arms, presumably stabilizing
the binding of the didomain through additional non-sequence-specific interactions.
The isolated B domain can, however, bind to the central of the junction.
The preferential binding of the A domain of the AB didomain to the central
correlates with our previous binding of a higher preference of the isolated
A domain than of the B domain for this structurally distinct DNA ligand.
It is probably at least partly due to the higher positive surface potential
on surface of the A domain and orientation of helix .
References:
1.Pohler, J. R. G., Norman, D. G., Bramham, J., Bianchi,M. E. & Lilley,
D. M. J. (1998). HMG box proteins bind to four-way DNA junctions in their
open conformation. EMBO J. 17, 817-826.
2. Ohndorf, U-M., Rould, M. A., He, Q., Pabo, C. O. &Lippard, S.
J. (1999). Basis for recognition of Cis-platin-modified DNA by high-mobility
group proteins. Nature 399, 708-712.
3.Allain, F. H.-T., Yen, Y.-M., Masse, J. E., Schultze, P.,Dieckmann,
T., Johnson, R. C. & Feigon, J. (1999). Solution structure of
the HMG protein NHP6A and its interaction with DNA reveals the structural
determinants for non-sequence-specific binding. EMBO J.18,
2563-2579.